Termékek bhd318 00 (6)

The EP103T LVDS transmitter supports transmission between the host and the flat panel display up to SXGA+ resolutions. The transmitter converts 25 bits (8bits/color, 2 dummy bits) of Low Voltage TTL data and 3 control bits into 4 LVDS (Low Voltage Differential Signal) data streams. At a maximum input clock rate of 135MHz, each LVDS differential data pair speed is 945Mbps, providing a total throughput of 3.78Gbps. The transmitter can be configured to input clock rising edge or falling edge strobe through an external pin. Support 10MHz to 135MHz clock rates for HVGA to SXGA+ resolution Up to 3.78Gbps bandwidth PLL requires no external components Cycletocycle jitter rejection 3.3V to 1.8V Low Voltage TTL tolerant Input Programmable data and control strobe select Power down mode supported

Das Gehäuse für die Bedieneinheit RT BE45-x ist mit einem eingebauten Schloss abgesichert und besitzt für den Notfall eine transparente Schlagscheibe. Abschließbares AP‑Aluminium-Druckgussgehäuse mit Schlagscheibe, Schlüssel und Beschriftungsbogen in 32 Sprachen In 5 pulverbeschichteten Farben erhältlich

TRANSISTOR MG200H-1AL2 - S-2530009

Strappy Sandal Featuring Spiky Studs on Upper Warning: Extreme High Heels. Not Recommended for Walking or Dancing. Wholesale and retail sales are available on our website. WhatsApp Email or Mesaage contact us for Wholesale Prices and for terms of sales.

BG96 est une série de LTE Cat.M1/Cat.NB1/EGPRS+ GNSS BG96 is a series of LTE Cat.M1/Cat.NB1/EGPRS module offering a maximum data rate of 375kbps downlink and uplink. It features ultra-low power consumption, and provides pin-to-pin compatibility with Quectel LTE module EG91/EG95, Cat.NB1 (NB-IoT) module BC95, UMTS/HSPA module UG95/UG96 and GSM/GPRS module M95. With a cost-effective SMT form factor of 22.5mm × 26.5mm × 2.3mm and high integration level, BG96 enables integrators and developers to easily design their applications and take advantage from the module’s low power consumption and mechanical intensity. Its advanced LGA package allows fully automated manufacturing for high-volume applications. Fast time-to-market:Reference designs, evaluation tools and timely technical support minimize design-in time

Ultra-compact LTE Cat M1/Cat NB2 moduleLTE Cat M1/Cat NB2 module with ultra-low power consumption Compact SMT form factor ideal for size-constrained applications with tight space Super slim profile in LGA package Integrated RAM and Flash in baseband chipset Comprehensive set of hardware-based security features Fast time-to-market: reference designs, evaluation tools and timely technical support minimize design-in time and development efforts Robust mounting and interfaces Fast time-to-market:reference designs, evaluation tools and timely technical support minimize design-in time